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1 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 1 / 18 chip resistor network specification (convex) reference no. : sys ? eng ? 202 revision no. : u copy for reference only asj pte ltd a s j
2 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 2 / 18 1.0 scope..............................................................................................?.???... 3 2.0 part numberi ng system........................................................????... 3 3.0 rating............................................................................................????? 3 3.1 rating power......................................................................................????... 3 3.2 operating temper ature range............................................................????.. 3 3.3 storage temperat ure range................................................................????.. 4 3.4 flammability rating ???????????????????????. 4 3.5 moisture sensitivity level rating ?????????????????... 4 3.6 resistance range, resistance tolera nce and temperature coefficient of resistance ????????????.................................??????? 4 3.7 rated voltage.....................................................................................????... 4 4.0 marking on product ...............................................................????.. 4 5.0 component di mension ???????????????????.. 5 5.1 dimension ??????????????????????????? 5 5.2 schematic ???????????????????????.???? 5 6.0 electrical characteristics and test conditions....???? 6 ? 9 6.1 soldering profile ????????????????????????.. 10 ? 11 7.0 taping............................................................................................????? 12 7.1 structure of taping............................................................................????... 12 7.2 materials............................................................................................????... 12 7.3 leader and tr ailer ta pe.....................................................................????... 13 7.4 position of taped component.............................................................????.. 13 7.5 tape dimension....................................................................................???? 14 7.5.1 paper tape ??????????????????????????? 14 7.6 performance of taping.......................................................................????... 15 7.6.1 strength of carrier tape and top cover tape ??????????????.. 15 7.6.2 peel force of top cover tape ????????????????????. 15 7.6.3 minimum bending radius ????????????????????... 15 7.7 packaging...........................................................................................????... 16 7.7.1 standard packaging pan size ???????????????????... 16 7.7.2 identification ?????????????????????????? 16 7.7.3 reel dimension.................................................................................????? 17 8.0 solder land pattern ???????????????????... 18 9.0 applicable standards ..................................................??????? 18
3 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 3 / 18 1.0 scope this specification specified thick film chip resistor network used in high density smd mounting for higher productivity with re duced assembling cost. in case there are discrepancies in specifications between this specification and th e customer?s specifications, the latter shall precede. 2.0 part numbering system part numbering is made in accordance with the following system: ycn xx x - xxxx -x x resistor type no.of resistance tolerance packaging network resistor value code ycn-convex 10 2 f - 1% f - 5k 16 4 g - 2% t - 10k j - 5% y ? 20k z - zero ohm 3.0 rating 3.1 rated power table 1 (a) zero ohm jumper rated power type rated current dielectric withsta nding voltage resistance tolerance ycn10 1a 300v < 50 m YCN16 1a 300v < 50 m (b) resistor rated power type rated power max. working voltage max.overload voltage ycn10 1/16w 50v 100v YCN16 1/16w 50v 100v rated power shall be the load power correspondi ng to nominal wattage suitable for continuous use at 70 c ambient temperature. in case the ambient temperature exceeds 70 c, reduce the load power in accordance with derating curve in fig. 1. fig.1 power derating characteristics -55 70 rated 100 power 80 % 60 40 20 0 -60 -40 -20 0 20 40 60 80 100 120 140 ambient temperature ( c) 3.2 operating temperature range -55c +125c 125
4 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 4 / 18 3.3 storage temperature range -5c +40c 3.4 flammability rating : tested in accordance to ul94, v-0 3.5 moisture sensitivity level rating : level 1 3.6 resistance range, resistance tolerance a nd temperature coefficient of resistance. table 2 product no. of resistor resistance range temperature coefficient of resistance resistance tolerance 2, 4 10 to 1m 250ppm/c 1% & 2% ycn 10 10 to 1m 200ppm/c 5% ycn 16 2, 4 1 to 1m 200ppm/c 1%, 2% & 5% zero ohm jumper < 0.05 3.7 rated voltage the rated voltage is calculated from the rated power and nominal resistance by the following formula: e = p.r. where e : rated voltage (v) p : rated power (w) r : nominal resistance ( ) in case the value calculated by the formula exceeds the maximum working voltage given in table 1, the maximum working voltage in table 1 shall be regarded as the rated voltage. 4.0 marking on product the nominal resistance shall be marked on the surface of each resistor. table 3 marking on product part number color marking ycn10 YCN16 light brown tolerance : 1.0% (f) marking by four numerals tolerance: 2.0% (g), 5.0% (j) marking by three numerals chip jumper resistor the marking used shall be 0
5 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 5 / 18 5.0 component dimension 5.1 dimension type number of resistor abcde fg 2 0.300.10 1.000.10 0.650.05 1.00 0.10 0.300.10 0.150.10 0.250.10 ycn10 4 0.330.10 2.000.10 0.50 0.10 0.400.10 0.200.10 2 0.500.15 1.600.20 0.800.05 1.60 0.20 0.500.10 0.300.15 0.300.15 YCN16 4 3.200.20 unit of measurement : mm 5.2 schematic n = 4 r1 r2 --------- r n b 822 c a d 822 d e c b g e f f g a ycn type (convex)
6 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 6 / 18 6.0 electrical characteristics and test conditions characteristics specifications testing conditions zero ohm resistance 1 resistance value < 50 m resistance accuracy being fully rely with respect to tolerance of resistor. jis c 5202 5.1 application time to be within 5 secs . applied voltage for resistance measurement : <10 10~99 100~999 1k~ 9.9k 10k~ 99.9k 100k~99 9k 1m & over 0.1v 0.3v 1.0v 3.0 v 10.0 v 30.0 v 50.0 v 2 resistance temperature coefficient na refer section 3.4 table 2 jis c 5202 5.2 measure r at t o =25 0 c and after 45 minutes measure r at t=125 0 c. calculation : tcr(ppm/ 0 c)=r-r 0 * 1 *10 6 r 0 t-t 0 3 short time overload < 50 m (1%+0.05 ) jis c 5202 5. 5 apply at 2.5 times rated voltage for 5 seconds. applied voltage shall not exceed maximum overload voltage or current. 4 insulation resistance > 10g jis c 5202 5.6 apply 100v 15vdc for 1 minutes
7 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 7 / 18 5 dielectric withstanding no failure of resistor such as short- circuit, burning, breakdown. jis c 5202 5.7 apply 300vac for voltage < 50 m (1%+0.05 ) 1 minutes + 10secs. 6noise na 1~9 <-10db (0.32 v/v) jis c 5202 5.9 10~99 <-5db (0.52 v/v) vn(db) = t ?f(t-s) - d 100~999 <0db (1.0 v/v) 1k~9.9k <10db (3.2 v/v) 10k~99.9k <18db (5.6 v/v) 100k~999.9k <20db (10 v/v) >1m <30db (32 v/v) 7 terminal strength - bend test < 50m tolerance resistor. with no evidence of mechanical damage after releasing the pressure. (1%+0.05 ) jis c 5202 6.1.4(1) method 2 apply force till 3mm bend and hold for 30 1sec. measure resistance while applying pressure. 8 resistance to soldering heat < 50m (1%+0.05 ) jis c 5202 6.10 a) solder bath method preheat : 120 10 c for 40 secs. resistor dipped entirely in solder bath of 260 5 c for 10 1sec. b) reflow soldering method peak : 240 5 c 220 5 c for 40sec. c) soldering iron method bit temp.: 300 5 c application time of soldering iron is 3 1 sec. after which the sample shall be left at ambient temperature for 1~ 2 hrs before measurement.
8 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 8 / 18 9 solderability > 95% coverage jis c 5202 6.11 solder : 60% tin / 40% lead 215 3 c for 2 secs. 10 resistance to solvent < 50m (1%+0.05 ) marking shall be legible without mechanical damage in appearance. jis c 5202 6.9 immerse in 20 c~25 c isoproyl alcohol solvent for 60 10secs. 11 low temperature < 50m (1%+0.05 ) jis c 5202 7.1 -55 5 c for 1000 + hours sample shall be left at ambient temperature for 1~ 2 hrs after test before measuring final resistance. 12 low temperature with load < 50m (1%+0.05 ) jis c 5202 7.1 -55 5 c for 90 minutes, 0.1 rated continuous working voltage as per 3.5 shall be applied for 45 + minutes. voltage sample shall be left at ambient temperature for 8 hrs after the removal of the voltage for 15 + before measuring final resistance. 13 high temperature < 100m (1%+0.05 ) jis c 5202 7.2 125 5 c for 1000 + hours sample shall be left at ambient temperature for 1~ 2 hrs after test before measuring final resistance. 14 thermal shock (temperature cycling) < 50m (0.5%+0.05 ) for 1% tolerance resistor (1%+0.05 ) for 2%, 5% tolerance resistor jis c 5202 7.4 step temp. time (c) (minute) 1 -555 30 mins 2 255 5 mins max 3 1555 30 mins 4 255 5 mins max repeat step 1 to 4 for 5 cycles 48 0 5 0 5 0 48 0 +1 -0
9 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 9 / 18 15 resistance to damp heat ( humidity ) < 100m (0.5%+0.05 ) for 1% tolerance resistor (2.0%+0.05 ) for 2%, 5% tolerance resistor jis c 5202 7.5 40 5 c and 90~95%rh for 1000 0 48 hours sample shall be left at ambient temperature for 1~ 2 hrs after test before measuring final resistance. 16 loadlife < 100m (1.0%+0.05 ) for 1% tolerance resistor (3.0%+0.1 ) for 2%, 5% tolerance resistor jis c 5202 7.10 at 70 5 c apply dc rated voltage at 90minutes on, 30minutes off for 1000 0 48 hours sample shall be left at ambient temperature for 1~ 2 hrs after test before measuring final resistance.
10 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 10 / 18 6.1 soldering profile
11 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 11 / 18
12 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 12 / 18 7.0 taping 7.1 structure of taping taping of rectangularly punched carrier system 7.2 materials (1) every taping shall consist of materials as shown in table 4. (2) every taping shall not adversely affect the mechanical, electrical and solderability performances. (3) materials of taping shall generate no statics. (4) the taped products are stored at a temperature -5 to +40 c and a relative humidity 40 to 60% without exposing to direct sunlight a nd, after such conditioning, the tape shall show no deterioration in performances such as change in adhesion force or peel forces. table 4 materials of taping type carrier top cover bottom cover tape tape tape taping of rectangularly punched carrier system paper thermal adhesion polyester thermal adhesion paper top cover tape rectangularly punched carrier tape bottom cover tape rectangularly-hole component compartment sprocket hole
13 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 13 / 18 7.3 leader and trailer tape 1) leader tape the length of leader tape shall be at least 400 mm including 20 or more of rectangular holes (component compartments) in which no component is placed. the 20 or more empty component compartments sha ll be sealed with the top cover tape (see fig. 2). 2) trailer tape the trailer tape at the hub of reel shall be least 40 mm in length including carrier tape with empty component compar tments. the empty component compartments shall be sealed with the top cover tape. the last portion of the carrier ta pe shall release from the reel hub. fig. 2 explanation of leader and trailer tape 7.4 position of taped component position of taped component the angle made by the center line of taped component and the center line of component compartment shall not exceed 20 degrees (see fig. 3). fig. 3 angle between center line of component a nd center line of co mponent compartment a b 20 max center line of component compartment center line of component empty component compartment ( 20 hole min.) trailer 40mm min. portion equipped with surface mounting devices leader 400mm min. direction of unreeling
14 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 14 / 18 7.5 tape dimension 7.5.1 paper tape t p 1 d p 2 e f w a 1.0 max direction of unreeling paper [punched] remark : pitch tolerance over any 10 pitches of po is 0.20 mm type no of resistor abwe f tpo,p1p2 d 2 1.200.10 1.200.10 8.000.20 1.750.10 3.50 0.05 0.450.10 4.000.10 2.000.05 1.500.10 ycn10 4 2.200.10 2.000.20 2 1.900.10 1.900.20 8.000.20 1.750.10 3.50 0.05 0.750.10 4.000.10 2.000.05 1.500.10 YCN16 4 3.500.10 2.000.20 unit of measurement : mm p 0 b
15 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 15 / 18 7.6 performance of taping 7.6.1 strength of carrier tape and top cover tape when a tensile force of 10n (1.02 kgf) is app lied in the direction of unreeling the tape, the carrier tape and top cover tape shall withstand this force. 7.6.2 peel force of top cover tape the peel force of top cover tape shall be 0.1n to 0.7n (10 to 70 gf) when the top cover tape is pulled at a speed of 200mm/min with the angle between the tape during peel and the direction of unreeling maintained at 165 to 180 degree as illustrated in fig 4. direction of pull 165 to 180 rectangularly punched carrier tape direction of unreeling bottom cover tape fig. 4 peeling test 7.6.3 minimum bending radius when the tape is bent with the minimum be nding radius specified in fig 5 and table 5, components shall maintain their position a nd shall be free from abnormalities such as damage. table 5 type minimum bending radius tsr4g 25.0 mm tsr2g 30.0 mm tsr1g 40.0 mm fig. 5 explanation of minimum bending radius minimum bending radius (r)
16 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 16 / 18 7.7 packaging 7.7.1 standard packaging pan size packaging no. of resistor 2 4 ycn10 10000 10000 tape YCN16 5000 5000 7.7.2 identification a label indicating product type, resistance value and tolerance shall be pasted on the surface of each reel. how to read lot number : xxxx xx xx xxxx year mth day serialize number lot number : 8 digits running numbers date code : yyyymmdd yyyy - year mm - month dd - date marking reel qty manufacturing part descri p tio n manufacturing part numbe r lot number
17 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 17 / 18 7.7.3 reel dimension type no of resistor ab c d ww 1 tr 2 178 2.0 60 1 0 13 0.2 2.0 0.5 11 1.0 14.4 max 1.0 0.1 1.0 ycn10 4 178 2.0 60 1 0 13 0.2 2.0 0.5 11 1.0 14.4 max 1.0 0.1 1.0 2 178 2.0 60 1 0 13 0.2 2.0 0.5 11 1.0 14.4 max 1.0 0.1 1.0 YCN16 4 178 2.0 60 1 0 13 0.2 2.0 0.5 11 1.0 14.4 max 1.0 0.1 1.0 unit of measurement : mm w t a r d c b b w 1
18 doc 002 a s j title : chip resistor network specification (convex) doc no : sys-eng-202 page : 18 / 18 8.0 solder land pattern unit of measurement : mm 9.0 applicable standards jis c 5202 test methods of fixed resistors fo r electronic equipment. jis c 0806 packaging of electroni c components on continuous tapes (surface mount devices). mil-std-202 test methods for el ectronic and el ectrical parts. ipc/jedec j std 020b moisture / reflow sensitivity classification for non hermetic solid state surface mount devices. cpw b a cwpab 0.5 2.1 0.5 0.25 0.8 0.8 3.1 0.8 0.44 1.15 part ycn104 YCN164

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